Systems, methods, and apparatus for multilayer superconducting printed circuit boards / S. V. Uchaykin

Основной Автор-лицо: Uchaykin, S. V., specialist in the field of non-destructive testing, Engineer of Tomsk Polytechnic University, Doctor of physical and mathematical sciences, 1963-, Sergey VictorovichКоллективный автор (вторичный): D-Wave Systems Inc.Язык: английский.Страна: .Резюме или реферат: A superconducting printed circuit board, comprising a first electrically insulative substrate layer having a first surface and a second surface opposed to the first surface, at least a second electrically insulative substrate layer having a first surface and a second surface opposed to the first surface, the second electrically insulative substrate layer physically coupled to the first electrically insulative substrate layer, a first superconducting current path positioned on a first surface side of the first electrically insulative substrate layer, a second superconducting current path positioned between the first and second electrically insulative layer, and a third superconducting current path that extends through the first electrically insulative substrate layer and superconducting couples the first superconducting current path with the second superconducting current path..Тематика: труды учёных ТПУ | электронный ресурс | патенты Ресурсы он-лайн:Щелкните здесь для доступа в онлайн
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A superconducting printed circuit board, comprising a first electrically insulative substrate layer having a first surface and a second surface opposed to the first surface, at least a second electrically insulative substrate layer having a first surface and a second surface opposed to the first surface, the second electrically insulative substrate layer physically coupled to the first electrically insulative substrate layer, a first superconducting current path positioned on a first surface side of the first electrically insulative substrate layer, a second superconducting current path positioned between the first and second electrically insulative layer, and a third superconducting current path that extends through the first electrically insulative substrate layer and superconducting couples the first superconducting current path with the second superconducting current path.

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