Berlin, Germany: 4–9 September 2005, Proceedings of the 23th European Conference on Surface Science

References: p. 4259 (25 tit.)

The influence of copper modifying additive on state of gold in NaY and NH4-mordenite has been investigated. The presence of copper in Au/Cu/NM permits to stabilize fine gold particles (similar to 8 nm), while for Au/Cu/NaY large particles with unusual complex structure and size up to 80 inn were registered. Furthermore, copper favors the formation of gold particles at low temperature. It was revealed the interaction of gold with copper to facilitate the activation of sites at low temperature due to change of redox and electronic properties of gold species. Gold clusters or gold species with strong chemical interaction with copper ions are active in CO oxidation at low temperature being sensitive to sample pretreatment. Gold natioparticles are active at high temperature and are less sensitive to reaction conditions.