Systems, methods, and apparatus for cryogenic refrigeration / R. C. Black [et al.]

Альтернативный автор-лицо: Black, R. C., Randall C.;Hilton, J. P., Jeremy P.;Rose, G., Geordie;Petroff, J. C., Jacob Craig;Uchaykin, S. V., specialist in the field of non-destructive testing, Engineer of Tomsk Polytechnic University, Doctor of physical and mathematical sciences, 1963-, Sergey VictorovichКоллективный автор (вторичный): D-Wave Systems Inc.Язык: английский.Страна: .Резюме или реферат: Cryogenic refrigeration employs a pulse tube cryo-cooler and a dilution refrigerator to provide very low temperature cooling, for example, to cool superconducting processors. Continuous cryogenic cycle refrigeration may be achieved using multiple adsorption pumps. Various improvements may include multiple distinct thermal-linking points, evaporation pots with cooling structures, and/or one or more gas-gap heat switches which may be integral to an adsorption pump. A reservoir volume may provide pressure relief when the system is warmed above cryogenic temperature, reducing the mass of the system. Additional heat exchangers and/or separate paths for condensation and evaporation may be provided. Multi-channel connectors may be used, and/or connectors formed of a regenerative material with a high specific heat capacity at cryogenic temperature. Flexible PCBs may provide thermal links to components that embody temperature gradients. Various components may be pre-cooled, for example via a switchable thermalization system.Тематика: труды учёных ТПУ | электронный ресурс | патенты Ресурсы он-лайн:Щелкните здесь для доступа в онлайн
Тэги из этой библиотеки: Нет тэгов из этой библиотеки для этого заглавия. Авторизуйтесь, чтобы добавить теги.
Оценка
    Средний рейтинг: 0.0 (0 голосов)
Нет реальных экземпляров для этой записи

Title screen

Cryogenic refrigeration employs a pulse tube cryo-cooler and a dilution refrigerator to provide very low temperature cooling, for example, to cool superconducting processors. Continuous cryogenic cycle refrigeration may be achieved using multiple adsorption pumps. Various improvements may include multiple distinct thermal-linking points, evaporation pots with cooling structures, and/or one or more gas-gap heat switches which may be integral to an adsorption pump. A reservoir volume may provide pressure relief when the system is warmed above cryogenic temperature, reducing the mass of the system. Additional heat exchangers and/or separate paths for condensation and evaporation may be provided. Multi-channel connectors may be used, and/or connectors formed of a regenerative material with a high specific heat capacity at cryogenic temperature. Flexible PCBs may provide thermal links to components that embody temperature gradients. Various components may be pre-cooled, for example via a switchable thermalization system

Для данного заглавия нет комментариев.

оставить комментарий.