Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method / A. A. Sivkov [et al.]

Уровень набора: (RuTPU)RU\TPU\network\2008, IOP Conference Series: Materials Science and EngineeringАльтернативный автор-лицо: Sivkov, A. A., Specialist in the field of electric power engineering, Professor of Tomsk Polytechnic University, Doctor of technical sciences, 1951-, Aleksander Anatolyevich;Saygash, A.;Kolganova, J. L., specialist in the field of electric power engineering, Detailer of Tomsk Polytechnic University, 1991-, Julia Leonidovna;Shanenkov, I. I., specialist in the field of electric power engineering, Detailer of Tomsk Polytechnic University, 1990-, Ivan IgorevichКоллективный автор (вторичный): Национальный исследовательский Томский политехнический университет (ТПУ), Энергетический институт (ЭНИН), Кафедра электроснабжения промышленных предприятий (ЭПП)Язык: английский.Страна: .Резюме или реферат: We obtained the contact pair copper–aluminum copper coating by using a magneto plasma accelerator. The process is realized during supersonic copper plasma jet flowing into the chamber filled with the air atmosphere. Copper jet is carried out of the accelerating channel towards the aluminum target. Plasma jet is generated by coaxial magnetoplasma accelerator (CMPA) based on copper electrode system. The CMPA is supplied from the pulsed capacitive energy storage with the maximum value of stored energy of 360 kJ. The obtained copper–aluminum contact pairs have been analyzed by X–ray diffractometry and Nano hardness tester. The copper coating on the aluminum surface is uniform with thickness about 100 gm. Also in this paper it is shown that transitional contact resistance of copper–aluminum contact pair is at 2,5 times less than a direct connection of copper and aluminum (test contact pair)..Примечания о наличии в документе библиографии/указателя: [References: 8 tit.].Аудитория: .Тематика: электронный ресурс | труды учёных ТПУ Ресурсы он-лайн:Щелкните здесь для доступа в онлайн
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[References: 8 tit.]

We obtained the contact pair copper–aluminum copper coating by using a magneto plasma accelerator. The process is realized during supersonic copper plasma jet flowing into the chamber filled with the air atmosphere. Copper jet is carried out of the accelerating channel towards the aluminum target. Plasma jet is generated by coaxial magnetoplasma accelerator (CMPA) based on copper electrode system. The CMPA is supplied from the pulsed capacitive energy storage with the maximum value of stored energy of 360 kJ. The obtained copper–aluminum contact pairs have been analyzed by X–ray diffractometry and Nano hardness tester. The copper coating on the aluminum surface is uniform with thickness about 100 gm. Also in this paper it is shown that transitional contact resistance of copper–aluminum contact pair is at 2,5 times less than a direct connection of copper and aluminum (test contact pair).

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