Microstructure and Properties of the Composite on the Basis of Copper and Diamond / A. S. Ivashutenko, N. V. Martyushev, Yu. Yu. Drozdov

Уровень набора: (RuTPU)RU\TPU\network\11477, Key Engineering Materials, Scientific JournalОсновной Автор-лицо: Ivashutenko, A. S., specialist in the field of electrical engineering, Head of the Department of the Tomsk Polytechnic University, Candidate of technical sciences, 1981-, Alexander SergeevichАльтернативный автор-лицо: Martyushev, N. V., specialist in the field of material science, Associate Professor of Tomsk Polytechnic University, Candidate of technical sciences, 1981-, Nikita Vladimirovich;Drozdov, Yu. Yu., specialist in the field of material science, qualified worker of Tomsk Polytechnic University, 1990-, Yury YurievichКоллективный автор (вторичный): Национальный исследовательский Томский политехнический университет (ТПУ), Энергетический институт (ЭНИН), Кафедра электроснабжения промышленных предприятий (ЭПП);Национальный исследовательский Томский политехнический университет (ТПУ), Институт физики высоких технологий (ИФВТ), Кафедра материаловедения и технологии металлов (МТМ)Язык: английский.Серия: Advanced Materials and Alloys, Nanomaterials and NanotechnologyРезюме или реферат: The paper presents the experimental material on obtaining and researching of three-dimensional composite heat-conducting copper-diamond materials in the system of spark plasma sintering. Earlier [1-5], it was established that in order to achieve the effect of the increased heat conductivity of a composite it is necessary to create the conditions hindering the movement of heat flux on the interface boundary. In this work we have attempted to obtain the material with heat conductivity higher than that of pure copper due to addition of diamond powder and synthesis of the composite in the system of spark plasma sintering. For comparison, we have considered copper and diamond compositions in the ratios of 50/50 and 40/60 correspondingly. The results of the heat conductivity analysis have not exceeded the indices of pure copper; however, according to SEM data, it has been found that at SPS-sintering local domains with enhanced adhesion form on the surfaces of diamonds..Аудитория: .Тематика: электронный ресурс | труды учёных ТПУ | композитные материалы | медь | теплопроводность | алмазы Ресурсы он-лайн:Щелкните здесь для доступа в онлайн
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The paper presents the experimental material on obtaining and researching of three-dimensional composite heat-conducting copper-diamond materials in the system of spark plasma sintering. Earlier [1-5], it was established that in order to achieve the effect of the increased heat conductivity of a composite it is necessary to create the conditions hindering the movement of heat flux on the interface boundary. In this work we have attempted to obtain the material with heat conductivity higher than that of pure copper due to addition of diamond powder and synthesis of the composite in the system of spark plasma sintering. For comparison, we have considered copper and diamond compositions in the ratios of 50/50 and 40/60 correspondingly. The results of the heat conductivity analysis have not exceeded the indices of pure copper; however, according to SEM data, it has been found that at SPS-sintering local domains with enhanced adhesion form on the surfaces of diamonds.

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