Features of copper coatings growth at high-rate deposition using magnetron sputtering systems with a liquid metal target / G. A. Bleykher (Bleicher) [et al.]
Уровень набора: Surface and Coatings TechnologyЯзык: английский.Резюме или реферат: The article focuses on the study of growth conditions for metal coatings during the operation of magnetron sputtering systems with a liquid-phase target. It also discusses the trends of coating properties formation (in terms of copper example) depending on the growth conditions. The data of the experiments and calculations confirm that the appearance of intensive evaporation on the target surface allows increasing more than 10 times the deposition rate and deposited particles flux density in comparison to conventional sputtering with a cooled solid target at the same magnetron power.In the case of the magnetron sputtering system with a liquid-phase target, energy fluxes and particles ones towards the substrate during the coating growth and the substrate heating rate are much greater than at conventional magnetron deposition with a solid target.The combination of calculations and experiments have made it possible to reveal the structure of energy and particles fluxes towards the substrate during the operation of the magnetron sputtering system with a liquid-phase target. The contribution of these fluxes formed by different mechanisms in a wide range of magnetron power has also been found out. The analysis of structural and mechanical properties of copper films being deposited at different energy and particles fluxes ratio towards the substrate has been carried out. It has been found that at intensive evaporation the coating surface is smooth and uniform, and the size of grains decreases. The mechanical properties of coatings (adhesion and microhardness) have got higher values compared to the cases related to only sputtering..Примечания о наличии в документе библиографии/указателя: [References: p. 120 (31 tit.)].Аудитория: .Тематика: электронный ресурс | труды учёных ТПУ | магнетронное распыление | испарение | высокоскоростное взаимодействие | покрытия Ресурсы он-лайн:Щелкните здесь для доступа в онлайнTitle screen
[References: p. 120 (31 tit.)]
The article focuses on the study of growth conditions for metal coatings during the operation of magnetron sputtering systems with a liquid-phase target. It also discusses the trends of coating properties formation (in terms of copper example) depending on the growth conditions. The data of the experiments and calculations confirm that the appearance of intensive evaporation on the target surface allows increasing more than 10 times the deposition rate and deposited particles flux density in comparison to conventional sputtering with a cooled solid target at the same magnetron power.In the case of the magnetron sputtering system with a liquid-phase target, energy fluxes and particles ones towards the substrate during the coating growth and the substrate heating rate are much greater than at conventional magnetron deposition with a solid target.The combination of calculations and experiments have made it possible to reveal the structure of energy and particles fluxes towards the substrate during the operation of the magnetron sputtering system with a liquid-phase target. The contribution of these fluxes formed by different mechanisms in a wide range of magnetron power has also been found out. The analysis of structural and mechanical properties of copper films being deposited at different energy and particles fluxes ratio towards the substrate has been carried out. It has been found that at intensive evaporation the coating surface is smooth and uniform, and the size of grains decreases. The mechanical properties of coatings (adhesion and microhardness) have got higher values compared to the cases related to only sputtering.
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