Accumulation of Defects in Polycrystalline Copper-Aluminum Solid Solutions and the Role of Stacking Fault Energy / N. A. Koneva, L. I. Trishkina, T. V. Cherkasova [et al.]
Уровень набора: Bulletin of the Russian Academy of Sciences: PhysicsЯзык: английский.Резюме или реферат: Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established..Примечания о наличии в документе библиографии/указателя: [References: 14 tit.].Аудитория: .Тематика: электронный ресурс | труды учёных ТПУ | дефекты | поликристаллы | медь-алюминий | электронная микроскопия | пластические деформации Ресурсы он-лайн:Щелкните здесь для доступа в онлайнНет реальных экземпляров для этой записи
Title screen
[References: 14 tit.]
Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established.
Для данного заглавия нет комментариев.
Личный кабинет оставить комментарий.