Practical limits of pulsed thermal NDT: The concept of additive/multiplicative noise / V. P. Vavilov, A. O. Chulkov, V. V. Shiryaev
Уровень набора: NDT & E InternationalЯзык: английский.Страна: .Резюме или реферат: The approach to determining thermal nondestructive testing (TNDT) limits by defect parameters is presented on the base of the suggested concept of noise. The concept presumes that active TNDT limits are conditioned by the inherent noise, which can be conventionally classified for additive and multiplicative. It is shown that practical TNDT limits are associated with multiplicative noise, which can be conveniently expressed in terms of noise running contrast. Considering a certain interval of running contrast values adhered to a particular construction material can be useful when determining potentials of thermal NDT by minimal size and maximal depth of detected defects, for example, by using a simple analytical 1D model..Примечания о наличии в документе библиографии/указателя: [References: 17 tit.].Аудитория: .Тематика: электронный ресурс | труды учёных ТПУ | thermal nondestructive testing | additive and multiplicative noise | contrast-to-noise ratio | detection limit | data processing | modeling | неразрушающий контроль | аддитивные шумы | обработка данных | моделирование Ресурсы он-лайн:Щелкните здесь для доступа в онлайнTitle screen
[References: 17 tit.]
The approach to determining thermal nondestructive testing (TNDT) limits by defect parameters is presented on the base of the suggested concept of noise. The concept presumes that active TNDT limits are conditioned by the inherent noise, which can be conventionally classified for additive and multiplicative. It is shown that practical TNDT limits are associated with multiplicative noise, which can be conveniently expressed in terms of noise running contrast. Considering a certain interval of running contrast values adhered to a particular construction material can be useful when determining potentials of thermal NDT by minimal size and maximal depth of detected defects, for example, by using a simple analytical 1D model.
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