000 | 03951nla2a2200421 4500 | ||
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001 | 646497 | ||
005 | 20231030040731.0 | ||
035 | _a(RuTPU)RU\TPU\network\11633 | ||
035 | _aRU\TPU\network\11625 | ||
090 | _a646497 | ||
100 | _a20160302a2016 k y0engy50 ba | ||
101 | 0 | _aeng | |
105 | _ay z 100zy | ||
135 | _adrcn ---uucaa | ||
181 | 0 | _ai | |
182 | 0 | _ab | |
200 | 1 |
_aMicrostructure and Properties of the Composite on the Basis of Copper and Diamond _fA. S. Ivashutenko, N. V. Martyushev, Yu. Yu. Drozdov |
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203 |
_aText _celectronic |
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225 | 1 | _aAdvanced Materials and Alloys, Nanomaterials and Nanotechnology | |
300 | _aTitle screen | ||
330 | _aThe paper presents the experimental material on obtaining and researching of three-dimensional composite heat-conducting copper-diamond materials in the system of spark plasma sintering. Earlier [1-5], it was established that in order to achieve the effect of the increased heat conductivity of a composite it is necessary to create the conditions hindering the movement of heat flux on the interface boundary. In this work we have attempted to obtain the material with heat conductivity higher than that of pure copper due to addition of diamond powder and synthesis of the composite in the system of spark plasma sintering. For comparison, we have considered copper and diamond compositions in the ratios of 50/50 and 40/60 correspondingly. The results of the heat conductivity analysis have not exceeded the indices of pure copper; however, according to SEM data, it has been found that at SPS-sintering local domains with enhanced adhesion form on the surfaces of diamonds. | ||
333 | _aРежим доступа: по договору с организацией-держателем ресурса | ||
461 | 0 |
_0(RuTPU)RU\TPU\network\11477 _tKey Engineering Materials _oScientific Journal |
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463 | 0 |
_0(RuTPU)RU\TPU\network\11478 _tVol. 685 : High Technology: Research and Applications 2015 (HTRA 2015) _oThe IV International Conference, April 21-24, 2015, Tomsk, Russia _o[proceedings] _fNational Research Tomsk Polytechnic University (TPU) ; ed. N. V. Martyushev, A. M. Bogdan _v[P. 607-610] _d2016 |
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610 | 1 | _aэлектронный ресурс | |
610 | 1 | _aтруды учёных ТПУ | |
610 | 1 | _aкомпозитные материалы | |
610 | 1 | _aмедь | |
610 | 1 | _aтеплопроводность | |
610 | 1 | _aалмазы | |
700 | 1 |
_aIvashutenko _bA. S. _cspecialist in the field of electrical engineering _cHead of the Department of the Tomsk Polytechnic University, Candidate of technical sciences _f1981- _gAlexander Sergeevich _2stltpush _3(RuTPU)RU\TPU\pers\33076 |
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701 | 1 |
_aMartyushev _bN. V. _cspecialist in the field of material science _cAssociate Professor of Tomsk Polytechnic University, Candidate of technical sciences _f1981- _gNikita Vladimirovich _2stltpush _3(RuTPU)RU\TPU\pers\32906 |
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701 | 1 |
_aDrozdov _bYu. Yu. _cspecialist in the field of material science _cqualified worker of Tomsk Polytechnic University _f1990- _gYury Yurievich _2stltpush _3(RuTPU)RU\TPU\pers\36291 |
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712 | 0 | 2 |
_aНациональный исследовательский Томский политехнический университет (ТПУ) _bЭнергетический институт (ЭНИН) _bКафедра электроснабжения промышленных предприятий (ЭПП) _h186 _2stltpush _3(RuTPU)RU\TPU\col\18676 |
712 | 0 | 2 |
_aНациональный исследовательский Томский политехнический университет (ТПУ) _bИнститут физики высоких технологий (ИФВТ) _bКафедра материаловедения и технологии металлов (МТМ) _h73 _2stltpush _3(RuTPU)RU\TPU\col\18689 |
801 | 2 |
_aRU _b63413507 _c20160309 _gRCR |
|
856 | 4 | _uhttp://dx.doi.org/10.4028/www.scientific.net/KEM.685.607 | |
942 | _cCF |