000 02827nla2a2200445 4500
001 661486
005 20231030041748.0
035 _a(RuTPU)RU\TPU\network\32097
035 _aRU\TPU\network\32096
090 _a661486
100 _a20191227a2019 k y0engy50 ba
101 0 _aeng
105 _ay z 100zy
135 _adrcn ---uucaa
181 0 _ai
182 0 _ab
200 1 _aNanoindentation on coarse-grained (CG) and ultrafine-grained (UFG) C11000 grade copper
_fA. V. Filippov, S. Yu. Tarasov
203 _aText
_celectronic
300 _aTitle screen
320 _a[References: 11 tit.]
330 _aThe microstructures and nanoindentation characteristics of CG and ECAP UFG C11000 grade copper were investigated. It was found that all indentations demonstrated the presence of pile-ups, whose heights reduced as a function of the ECAP pass number. The pile-up height on the CG sample was less than that of the 1-pass ECAP sample but higher than those of 4- and 12-pass ECAP ones. The maximum hardness and elasticity modulus values were achieved after 12-pass ECAP.
333 _aРежим доступа: по договору с организацией-держателем ресурса
461 0 _0(RuTPU)RU\TPU\network\4816
_tAIP Conference Proceedings
463 0 _0(RuTPU)RU\TPU\network\31884
_tVol. 2167 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2019 (AMHS'19)
_oProceedings of the International Conference, 1–5 October 2019, Tomsk, Russia
_fNational Research Tomsk Polytechnic University (TPU) ; Institute of Strength Physics and Materials Science SB RAS (Russia) ; eds. V. E. Panin ; S. G. Psakhie ; V. M. Fomin
_v[020103, 4 p.]
_d2019
610 1 _aэлектронный ресурс
610 1 _aтруды учёных ТПУ
610 1 _aнаноиндентирование
610 1 _aмедь
610 1 _aмикроструктуры
610 1 _aтвердость
610 1 _aупругость
610 1 _aинденторы
610 1 _aскопления
610 1 _aпластические деформации
700 1 _aFilippov
_bA. V.
701 1 _aTarasov
_bS. Yu.
_cspecialist in the field of mechanical engineering
_cProfessor of Tomsk Polytechnic University, Doctor of technical sciences
_f1959-
_gSergei Yulievich
_2stltpush
_3(RuTPU)RU\TPU\pers\31400
712 0 2 _aНациональный исследовательский Томский политехнический университет
_bИнженерная школа новых производственных технологий
_bОтделение материаловедения
_h7871
_2stltpush
_3(RuTPU)RU\TPU\col\23508
801 2 _aRU
_b63413507
_c20200528
_gRCR
856 4 _uhttps://doi.org/10.1063/1.5131970
942 _cCF