High-Frequensy Short-Pulsed Metal Plasma-Immersion Ion Implantion Or Deposition Using Filtered DC Vacuum-ARC Plasma / A. I. Ryabchikov [et al.]

Уровень набора: Surface and Coatings Technology = 2004-Альтернативный автор-лицо: Ryabchikov, A. I., Professor of Tomsk Polytechnic University, Doctor of physical and mathematical sciences, physicist, 1950-, Aleksandr Ilyich;Ryabchikov, I. A.;Stepanov, I. B.;Usov, Y. P., Professor of Tomsk Polytechnic University, Electrical engineer, Doctor of Technical Sciences, 1937-, Yuri PetrovichЯзык: английский.Страна: .Резюме или реферат: A new approach to the development of advanced coating deposition and ion implantation method including an application of filtered dc metal plasma and high-frequency short-pulsed negative bias voltage with a duty factor in the range of 10-99% are considered. The ion energy spectrum for different negative bias potential pulse durations (120-1100ns) was measured. The chart of various methods of ion beam and plasma material treatment using high-frequency short pulse metal plasma immersion ion implantation or deposition depending on bias pulse duty factor and amplitude for Cu plasma is presented. The ion assisted coating deposition has been examined depending on samples conductivity and thickness, plasma concentration, pulse repetition rate, amplitude, and duty factor..Аудитория: .Тематика: труды учёных ТПУ
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A new approach to the development of advanced coating deposition and ion implantation method including an application of filtered dc metal plasma and high-frequency short-pulsed negative bias voltage with a duty factor in the range of 10-99% are considered. The ion energy spectrum for different negative bias potential pulse durations (120-1100ns) was measured. The chart of various methods of ion beam and plasma material treatment using high-frequency short pulse metal plasma immersion ion implantation or deposition depending on bias pulse duty factor and amplitude for Cu plasma is presented. The ion assisted coating deposition has been examined depending on samples conductivity and thickness, plasma concentration, pulse repetition rate, amplitude, and duty factor.

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