Influence of Surface Treatment of Copper Substrates by Titanium Ions on Structure and Thermomechanical Properties of Nanocomposite Coatings on the Basis of Si-Al-N / V. P. Sergeev [et al.]

Уровень набора: (RuTPU)RU\TPU\network\4598, Advanced Materials Research : Advanced materials, synthesis, development and application, Scientific JournalАльтернативный автор-лицо: Sergeev, V. P., specialist in the field of materials science, Professor of Tomsk Polytechnic University, doctor of technical Sciences, 1949-, Viktor Petrovich;Fedorischeva, M. V.;Neufeld, V. V.;Kalashnikov, M. P.Коллективный автор (вторичный): Национальный исследовательский Томский политехнический университет (ТПУ), Институт физики высоких технологий (ИФВТ), Кафедра физики высоких технологий в машиностроении (ФВТМ)Язык: английский.Серия: Chemistry and Physics of Materials SurfaceРезюме или реферат: Processing of copper substrates by Ti ions was carried out using "KVANT-03MI" equipment by means of a vacuum-arc ionic source with the titanium cathode. By X-ray and SEM methods it was established that after ionization in the surface layer of substrate the intermetallides of Cu-Ti system form. There is the CuTi3 preferred phase in surface layer of substrate depending on time of processing by Ti ions. The mechanism of formation of observable net structure of surface layer by sputtering of copper atoms by Ti ions the subsequent deposition and their crystallization in the form of microislets of CuTi3 intermetallide on surface of a copper substrate have been suggested..Аудитория: .Тематика: электронный ресурс | труды учёных ТПУ | нанокомпозитные покрытия | теплозащитные покрытия | термомеханические свойства | структуры Ресурсы он-лайн:Щелкните здесь для доступа в онлайн
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Processing of copper substrates by Ti ions was carried out using "KVANT-03MI" equipment by means of a vacuum-arc ionic source with the titanium cathode. By X-ray and SEM methods it was established that after ionization in the surface layer of substrate the intermetallides of Cu-Ti system form. There is the CuTi3 preferred phase in surface layer of substrate depending on time of processing by Ti ions. The mechanism of formation of observable net structure of surface layer by sputtering of copper atoms by Ti ions the subsequent deposition and their crystallization in the form of microislets of CuTi3 intermetallide on surface of a copper substrate have been suggested.

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