Deposition of Cr films by hot target magnetron sputtering on biased substrates / D. V. Sidelev [et al.]

Уровень набора: Surface and Coatings TechnologyАльтернативный автор-лицо: Sidelev, D. V., physicist, engineer of Tomsk Polytechnic University, 1991-, Dmitry Vladimirovich;Bestetti, M., physicist, Researcher of Tomsk Polytechnic University, 1965-, Massimiliano;Bleykher (Bleicher), G. A., physicist, Professor of Tomsk Polytechnic University, Doctor of Physical and Mathematical Sciences, 1961-, Galina Alekseevna;Krivobokov, V. P., Russian physicist, professor of Tomsk Polytechnic University (TPU), Doctor of Physical and Mathematical Sciences (DSc), 1948-, Valery Pavlovich;Grudinin, V. A., physicist, engineer of Tomsk Polytechnic University, 1995-, Vladislav Alekseevich;Franz, S., Silvia;Vicenzo, A., Antonello;Shanenkova, Yu. L., specialist in the field of electric power engineering, laboratory assistant of Tomsk Polytechnic University, 1991-, Yuliya LeonidovnaКоллективный автор (вторичный): Национальный исследовательский Томский политехнический университет, Инженерная школа ядерных технологий, Научно-образовательный центр Б. П. ВейнбергаЯзык: английский.Резюме или реферат: The Cr films were deposited by hot target magnetron sputtering on grounded and biased substrates. The deposition modes with low and high deposition rates (different by 4 times) were selected. The sublimation of hot Cr target decreased the re-sputtering effect of the growing films under ion bombardment and reduced the losses of deposition rate from 28.7 to 13.4% (for −40 V bias and 1.9 kW discharge power). The calculations of energy flux densityon the substrate revealed that the major contribution has a target radiation (56.2…85.5%) and kinetic energy of deposited particles and ions (4.8…34.3%) become a significant only with substrate biasing. The XRD measurements showed cubic structured (110) Cr films with compressive stresses (0.48…0.90 GPa), which is non-dependent from bias voltage for high-rate deposition modes. The Cr films mainly had a columnar structure and columnar width increased from 50 to 450 nm with rise of discharge power (W). The substrate biasing and high deposition rate resulted in the formation of irregular microstructure of the Cr films along their thickness from porous to columnar state. The indentation tests showed the strong dependence of film hardness and toughness (H/E) from W and different behavior of the mechanical properties of the Cr films for the deposition on biased substrates with low and high deposition rates..Примечания о наличии в документе библиографии/указателя: [References: 49 tit.].Аудитория: .Тематика: электронный ресурс | труды учёных ТПУ | hot target sputtering | Cr film | substrate bias | structure | mechanical properties | распыление | смещения | субстраты | механические характеристики Ресурсы он-лайн:Щелкните здесь для доступа в онлайн
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[References: 49 tit.]

The Cr films were deposited by hot target magnetron sputtering on grounded and biased substrates. The deposition modes with low and high deposition rates (different by 4 times) were selected. The sublimation of hot Cr target decreased the re-sputtering effect of the growing films under ion bombardment and reduced the losses of deposition rate from 28.7 to 13.4% (for −40 V bias and 1.9 kW discharge power). The calculations of energy flux densityon the substrate revealed that the major contribution has a target radiation (56.2…85.5%) and kinetic energy of deposited particles and ions (4.8…34.3%) become a significant only with substrate biasing. The XRD measurements showed cubic structured (110) Cr films with compressive stresses (0.48…0.90 GPa), which is non-dependent from bias voltage for high-rate deposition modes. The Cr films mainly had a columnar structure and columnar width increased from 50 to 450 nm with rise of discharge power (W). The substrate biasing and high deposition rate resulted in the formation of irregular microstructure of the Cr films along their thickness from porous to columnar state. The indentation tests showed the strong dependence of film hardness and toughness (H/E) from W and different behavior of the mechanical properties of the Cr films for the deposition on biased substrates with low and high deposition rates.

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